Trace Printed Circuit Board Design LTD.

PCB Capabilities


Object
Processing capacity(Metric)
Note
max panel size
40"x20"(1016mm x508mm)
 
innerlayer line width/space(min)
3mil/3mil(76um/76um)
 
min innerlayer clearance
5mil(0.13mm)
 
min innerlayer pad
5mil(0.13mm)
Referring to Weld Central relief
min core thickness
4mil(0.1mm)
Non-Copper Foil
min dielectric thickness
3mil(76um)
 
thickness of inner copper
1/3oz、1/2oz、1oz、2oz、3oz
(12um、17um、35um、70um、105um)
 
thickness of outerlayer base copper
1/3oz、1/2oz、1oz、2oz、3oz
(12um、17um、35um、70um、105um)
 
thickness of finished panel
0.20-4.0mm
 
tolerance of finished panel thickness
Thickness<1.0mm
±12%
4-8layer
1.0mm≤Thickness2.0mm
±8%
4-8layer
±10%
≥10layer
Thickness≥2.0mm
±10%
 
surface treating technic of innerlayer
Black / brown oxidation
 
layer number
0~32
 
registration of innerlayer to innerlayer
±2mil(±50um)
 
min drilling diameter
0.20mm
 
min diameter of finished hole
0.15mm
 
accuracy of hole position
±2mil(±50um)
 
tolerance of drilled slot
±3mil(±75um)
 
tolerance of PTH diameter
±2mil(±50um)
 
tolerance of NPTH diameter
±1mil(±25um)
 
max A.R. of PTH
10:1
 
PTH hole copper thickness
0.4-2mil(10-50um)
 
image to image tolerance
±3mil(0.075mm)
 
outer layer line width/space(min)
3mil/3mil(76um/76um)
 
tolerance of line width
±1mil(±25um)
 
type of solder mask
Green/Red/Yellow/Black/Purple/White/Matt Green/Matt Black etc
 
thickness of solder mask
Top Line
0.4-1.2mil(10-30um)
 
Line corner
≥0.2mil(5um)
Substrates
≤thick copper+1.2mil
(≤thick copper+30um)
 
 
 
solder mask registration tolerance
±2mil(50um)
 
min solder mask dam
3.0mil(75um)
 
max solder mask plug hole diameter
0.8mm
 
surface treating technics
HASL-LF.OSP.immersion gold,Plating Gold,immersion Ag
 
max nickle thickness of gold finger
280u″(7um)
 
max gold thickness of gold finger
60u″(1.5um)
 
range of nickle thickness
100u″/240 u″(2.5um/6um)
 
range of gold thickness
1u″/6 u″(0.05um/0.15um)
 
min routing dimension tolerance(edge to edge)
±4mil(±0.10mm)
 
min routing dimension tolerance(hole to edge)
±3mil(0.075mm)
 
V-cut angle
30°,45°,60°, 90°
 
range of bevel angle
20°~60°
 
min legend line width/space
5mil/5mil(0.125mm/0.125mm)
 
peel strength of line
≥6lB/in(≥107g/mm)
 
ionic contamination
<1.0ugNaCl/cm2
 
impedance control and tolerance
50Ω±10%
 
bow and twist
≤0.5%
 
type of dielectric material
CEM3、FR-4、 Material from Halogen、
Tg175℃ FR-4、High CTI materials, CAF-resistant materials
 
 
other technics
India carbon oil, and India can be separated oil silver paste filling holes
 

 


   
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